Members of the Texas Instruments Widebus? The devices are designed for asynchronous communication between two data buses. The logic levels of the direction-control DIR input and the output-enable OE input activate either the B-port outputs or the A-port outputs or place both output ports into the high-impedance mode. The device transmits data from the A bus to the B bus when the B-port outputs are activated, and from the B bus to the A bus when the A-port outputs are activated. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.
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Members of the Texas Instruments Widebus? The devices are designed for asynchronous communication between two data buses. The logic levels of the direction-control DIR input and the output-enable OE input activate either the B-port outputs or the A-port outputs or place both output ports into the high-impedance mode.
The device transmits data from the A bus to the B bus when the B-port outputs are activated, and from the B bus to the A bus when the A-port outputs are activated. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state.
Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. When VCC is between 0 and 1. However, to ensure the high-impedance state above 1. These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On all other products, production processing does not necessarily include testing of all parameters.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
The package thermal impedance is calculated in accordance with JESD VCC TA 1 Supply voltage High-level input voltage Low-level input voltage Input voltage High-level output current Low-level output current Input transition rise or fall rate Power-up ramp rate Operating free-air temperature Outputs enabled —55 2. It is the minimum overdrive current required to switch the input from one state to another.
CL includes probe and jig capacitance. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. The outputs are measured one at a time, with one transition per measurement. Figure 1. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Samples may or may not be available. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All linear dimensions are in inches millimeters. This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit. All linear dimensions are in millimeters. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Body dimensions do not include mold flash or protrusion not to exceed 0. Body dimensions do not include mold protrusion not to exceed 0, Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.
Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components.
To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Juran By usingthe output signals is good cd KHz, after my signals is bad, after KHz not detect 3v3 high state. So much like the previous part, it might be usable for 3. Calibration involves comparing the read values of a measuring instrument or data recorder with the corresponding values of a reference tool that meets the reference standards. Also, no actual resistor is ideal, so even the resistors themselves have a tiny amount of capacitance. Can I get my instruments re-calibrated and is it necessary? Usually the time for the calibration of your device can be handled datasheeet 5 working days. What pins and components would I need to use?
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